期刊文献+

复合材料胶接修复金属构件残余热应力研究进展 被引量:2

Advances in Research of Thermal Residual Stresses in Bonded Composite Repairs of Metallic Components
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摘要 复合材料补片胶接技术是一种有效修复飞机受损构件的低成本方法。由于补片与金属材料热膨胀系数的显著差异,会在构件中引入残余热应力。归纳了复合材料修复技术中关于残余热应力的研究热点及成果,涉及常用的残余热应力分析模型、结构约束及固化制度对残余热应力的影响、减小残余热应力的途径等,并对今后的研究工作进行了展望。 Composite patching has been proven to be an efficient and economical method to repair damaged aircraft components. The significant difference in thermal expansion coefficients between the composite patch and the metallic substrate would introduce thermal residual stresses in the components. Research achievements of the thermal residual stresses in composite repairs of metallic components are reviewed, including some widely used models to predict thermal residual stresses, influences of restraint by the surrounding structure and curing cycles on the thermal residual stresses, and methods to minimize the residual stresses. Some recommendations for future work are also presented. repair
出处 《机械工程材料》 CAS CSCD 北大核心 2007年第4期5-8,共4页 Materials For Mechanical Engineering
基金 武器装备预研基金(51489040105KG0101)
关键词 残余热应力 复合材料补片 金属构件 胶接修复 thermal residual stress composite patch metallic component bonded
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参考文献25

  • 1Baker A A. Repair of cracked or defective metallic aircraft components with advanced fibre composites-an overview of australian work[J]. Composite Structures, 1984,2 : 153 -- 181.
  • 2Baker A A, Callinan R J, Davis M J,et al. Repair of Mirage Ⅲ aircraft using BFRP crack patching technique[J]. Theoretical & Applied Fracture Mechanics, 1984,2 : 1 -- 16.
  • 3Baker A A, Rose L R F, Walker K F, et al. Repair substantiation for a bonded composite repair to F-111 lower wing skin [J]. Applied Composite Materials, 1999,6 : 251 -- 267.
  • 4Jones R, Molent L. Application of constitutive modeling and advanced repair technology to F-111C aircraft [J]. Composite Structures, 2004,66 : 145-157.
  • 5徐建新.复合材料补片胶接修理技术的研究进展[J].航空学报,1999,20(4):381-383. 被引量:28
  • 6Baker A A, Jones R. Bonded repair of aircraft structures[M]. Dordrecht: Martinus Nijhoff, 1988:122--131.
  • 7Wang C H, Rose L R F, Callinan R,et al. Thermal stresses in a plate with a circular reinforcement[J]. International Journal of Solids & Structures,2000,37(33):4577--4599.
  • 8Fredell R S. Damage tolerant repair techniques for pressurized aircraft fuselages[D]. Delft: University of Technology, 1994.
  • 9Baker A A, Jones R. Bonded repair of aircraft structures[M].Dordrecht: Martinus Niihoff, 1988 : 90-- 92.
  • 10Daverschot D R, Vlot A, Woerden H J M. Thermal residual stresses in bonded repairs[J]. Applied Composite Materials, 2002,9: 179--197.

二级参考文献3

  • 1徐建新.损伤金属结构的复合材料胶接修补技术研究[M].南京:南京航空航天大学,1996..
  • 2Sun C T,AIAA J,1996年,34卷,2期,369页
  • 3徐建新,学位论文,1996年

共引文献27

同被引文献22

  • 1游敏,郑小玲,郑勇.金属胶接接头的内应力及其消除[J].中国胶粘剂,1996,5(3):26-28. 被引量:18
  • 2李智,游敏,丰平.胶接接头界面理论及其表面处理技术研究进展[J].材料导报,2006,20(10):48-51. 被引量:32
  • 3Karthik R, Zhao W. Evolution residual stresses in thermoplastic bonding to metals[J]. Int J Adhes Adhes, 1997, 17 (4):353.
  • 4Anifantis N K, Kakavas P A, Papanicolaou G C. Thermal stress concentration due to imperfect adhesion in fiber reinforced composites[J].Compos Sci Techn, 1997, 57(6) :687.
  • 5Lee S J, Lee D G. Optimal-design of the adhesively bonded tubular single lap joint [J].J Adhes, 1995,50(2- 3):165.
  • 6Kim Y G, Lee S J, Lee D G, et al. Strength analysis of adhesively bonded tubular single lap steel-steel joints under axial loads considering residual thermal stresses[J]. J Adhes, 1997,60 (1-4) : 125.
  • 7Cho J H, Kong D I, Park C E, et al. Effect of curing temperature on the adhesion strength of polyamideimide/ copper joints[J]. J Adhes Sci Teehn, 1998,12(5) :507.
  • 8Humfeld G R, Dillard D A. Residual stress development in adhesive joints subjected to thermal cycling[J]. J Adhes, 1998,65(1-4) : 277.
  • 9Abedian A, Szyszkowski W. Effects of surface geometry of composites on thermal stress distribution-a numerical study [J]. Compos Sci Techn,1999,59(1):41.
  • 10Apalak M K, Gunes R. On non-linear thermal stresses in an adhesively bonded single lap joint[J]. Comput Struet, 2002,80:85.

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