叔胺的羧酸复盐对酸酐/环氧树脂体系固化反应和固化物性能的影响

本文应用示差扫描量热和旋转粘度计等手段研究了叔胺（DMP－30）的羧酸复盐对酸酐固化环氧树脂体系的潜伏促进性和固化反应动力学的影响。结果表明，这种叔胶羧酸盐与叔胺一样可作为酸酥／环氧树脂体系的固化促进剂，且具有一波的潜伏性。在室温下，该体系的贮存期是通常叔肤的6～8倍。整个固化反应过程遵循准一级动力学方程。两固化体系的机电热性能略有差异。

The latent curing acceleration of the carboxylic acid double salt of tertiary amine (DMP-30)for the anhydride curable epoxy resin system and the curing kinetics of the system were studied by DSC and rotation visconleter etc;and comparison were made with the curing effeciency of DMP-30.the results show that like tertiary amine,double salt of tertiary amine has accelerating effect on curing of anhydride/epoxy resin system and has a certain degree of latent tendency. The system containing double salt of tertiary amine has a storage period 6- 8times longer than the system containing tertiary amine. The overall curing process followed quasi-first order kinetics.The electrical,mechanical,and thermal properties of the two systems showed a little difference.