摘要
介绍了超高亮度发光二极管(UHB-LED)芯片切割工艺中砂轮切割、金刚刀划片及激光切割的应用情况、工艺原理、工艺特点和发展前景。结合生产实践,对比和分析了不同切割工艺的优缺点,针对不同切割生产工艺中存在的芯片正崩、芯片背崩、芯片脱落以及划片裂片不良等问题进行了探讨并提出了解决方法。指出激光切割技术是LED芯片切割工艺发展的必然趋势。
The principle, applications, characteristics and prospects of dicing saw, diamond scriber and
laser scriber technology for UHB-LED chip manufacturing process were presented. The main advantages and shortcomings of those technologies were also compared and analyzed. The methods how to solve processing problems such as chip lost out, chip collapse and scribe failure were subjected. It points out that laser technology is the key way to develop UHB-LED chip scribing process.
出处
《半导体技术》
CAS
CSCD
北大核心
2007年第7期606-609,共4页
Semiconductor Technology
