低温共烧陶瓷多层基板精细互连技术

Fine Interconnection Technologies for Multilayer LTCC Substrates

微电子技术和封装工艺的发展使超大规模集成电路(VLSI)的密度越来越高,而高密度低温共烧陶瓷(LTCC)基板的制作依赖于基板内部导体的精细互连技术。为了满足LTCC多层基板高密度互连的工艺要求,必须使基板微通孔的直径及导线线宽缩小到100μm以内。基于此,首先介绍了LTCC生瓷带层的微通孔形成与填充工艺,以及所形成的微通孔的特点;利用厚膜丝网印刷技术形成精细导线,分析了影响印刷质量的工艺参数;最后简要介绍了薄膜光刻等新技术。通过应用上述几种先进的精细互连工艺技术,极大地提高了LTCC多层基板的互连密度。

With the develooment of microelectronics and packaging technologies, VLSI circuit densities increase a lot. The fabrication of high density low temperature co-fired ceramic （LTCC） substrates depends on the fine interconnection technology of the conductor. In order to meet the requirement of high density interconnections of LTCC muhilayer substrates, the size of via and line/spacing of the conductor must be reduced under 100μm. The process of micro-via formation and micro-via fill, and the important characteristic of micro-via were introduced. Then the screen printing technology of fine conductor was discussed, including some process parameters which affected the quality of printing conductor. Finally, some new techniques as photo-imaginable were presented. Exploiting the advanced fine interconnection techniques, the interconnection densities of LTCC muhilayer substrates are improved significantly.