复合镀铜溶液中微粒与镀液间的相互作用

Interaction Between Particles and Solution in Composite Copper Plating Solution

研究了复合镀铜溶液中SiO2、La2O3、BN以及SiC微粒与镀液间的相互作用。通过测定镀液的pH以及微粒表面的Zeta电位,研究了微粒对镀液中氢离子以及铜离子的吸附。结果表明,加入复合镀铜溶液中的SiO2、La2O3、BN以及SiC微粒不仅吸附了镀液中的氢离子,同时还吸附了镀液中的铜离子,致使镀液的pH上升,微粒表面荷正电。纳米粒子对镀液中荷电粒子的吸附能力较微米粒子更强。

The interactions between the particles including SiO2, La2O3, BN and SiC and solution in composite copper plating baths were investigated. The adsorptions of the particles to H^＋ and Cu^2＋ ions in the solution were analyzed by measuring pH of solution and Zeta potential of particle surface. The results show that SiO2, La2O3, BN and SiC particles in the plating solution adsorb H＋ and Cu^2＋ ions simultaneously. This causes the increase in pH of the solution and carrying positive electric charge on surface of the particles. The adsorption ability of nano-particles is stronger than that of micro-particle.