射频离子镀氮化钛的实验研究

Experimnetal Stucdy on RF Ionic Tin Plating

较系统地研究了射频离子镀氮化钛工艺。分析了各参数之间的制约关系,提出了合理控制工艺参数的方法。研究结果表明,射频离子镀的成膜速度随炉内压力的减小而加快,电子枪功率的加大将提高了离子束电流强度,基板与蒸发源距离的加大将降低成膜速度;粒子的入射角度在 45°—135°为宜。但成膜速度与射频起振器功率、基板的负偏压无关。要想提高离子的密度,必须加大电子枪功率,同时要增大射频的起振动率。

Investigaes systematically the technological process of radio--frequency ionicTiN plating. A reasonable method is suggested for controlling technicalparameters, based on an analysis of the relationships among all influncingfactors.Experimental results indicate that when using this process the formingrate of plating film increases with the decrease in pressure inside furnace. Theincrease in the power of electronic gun will raise the current density of ionbeam, and the increase in the distance from substrate to evaporation sourcewill lower the forming rate of plating film. The incident angle of particles isfound suitable if it is 45°--135°. But the forming rate is independent of thepower of RF oscillator and the negative bias of substrate. To increase theionic density, it is necessaiy to increase the powers of electronic gun and ofRF oscillator.