摘要
如何提高大功率LED的散热能力,是LED器件封装和器件应用设计要解决的核心问题。本文详细分析了国内外大功率LED散热封装技术的研究现状,总结了其发展趋势并提出减少内部热沉可能是今后的发展方向。
How to improve application design of heat-release package reducing the internal the heat-sinking capability is one of the key technical problems for the package and device concerned with high-power LEDs. In this paper, the present technical research on of high-power LEDs is analyzed, and the trend is summarized. Besides, it suggests that heat sink may be one of the developments in the future.
出处
《照明工程学报》
2007年第2期69-71,55,共4页
China Illuminating Engineering Journal
关键词
大功率LED
散热
封装
high power LED
heat release
package
