单纤三向器件平面光波导芯片结构优化设计

Optimized design of triplexer chips based on planar lightwave circuit

文章对采用平面光波导技术的单纤三向器件(Triplexer)芯片结构的参数进行了优化设计,对单元结构的光谱响应进行了模拟计算,通过数值模拟分析了结构的工艺容差性。结果表明,采用双模耦合器和M-Z干涉仪结构可以得到工艺容差性高、光谱响应优良的适用的Triplexer器件。

Design optimization of a novel triplexer chip structure based on Planar Lightwave Circuit （PLC） for fiber-to-the premise applications is described, calculations of the spectral responses of the unit structure performed and the technological tolerance of the structure analyzed by numerical simulations. The results show that rriplexer chips with high tolerance and improved spectral response can be fabricated by using two-mode couplers and Mach-Zehnder interferometer.