摘要
随着现代电子技术的发展以及芯片的高速化和集成化,各种电子设备系统内外的电磁环境更加复杂,因此在印制电路板的电路设计阶段考虑电磁兼容性(EMC)设计是非常重要的.以12层板为例讨论了多层PCB分层方法、布线的规则、地线和电源线布置以及电磁兼容性.
With development of electronic technique and chip integration, electro-magnetic environment of muhi-eletronic equipment is more and more complicated so as in the design of the Printed Circuit Board. It is very important to take electro-magnetic compatibility into account. This paper discusses the electro-magnetic compatibility of the multilayer Printed Circuit Board, through delimitation and regulation of the singal line, electronic source line and grounding line.
出处
《合肥学院学报（自然科学版）》
2007年第3期19-21,55,共4页
Journal of Hefei University :Natural Sciences
基金
安徽省教育厅科研基金重点项目(2004kj002zd)资助
关键词
电磁兼容
多层印刷电路板
布线
接地
electro magnetic compatibility
muhilayer printed circuit board
design
grounding
