摘要
主要介绍了目前主流白光LED的封装方法,简述了各种方法的原理及优缺点。重点介绍了蓝光芯片与黄光荧光粉混合实现白光LED的机制。通过测试芯片发射谱、不同荧光粉材料的激发和发射谱,重点研究了蓝色芯片与黄色荧光粉材料的光谱匹配性,讨论了荧光粉材料的选取对器件的电学、光学性能的影响。
Packaging methods and manufacturing processes for white LEDs were introduced in this paper. Principles, advantages and limits for different methods were presented individually. The most popular luminescence conversion mechanism, by coating a blue LED chip with YAG：Ce3＋ yellow phosphors, was discussed in detail. Electro luminescence （EL） spectrum of a blue LED chip, excitation spectrums and emission spectrums of different kinds of phosphor materials were investigated. The matching of the spectrum of the blue light of LED chip and the the yellow light of those phosphors was studied. The effect of the choice of phosphor materials on the electronic and optical properties for white LEDs was also discussed.
出处
《现代显示》
2007年第8期59-63,共5页
Advanced Display
