摘要
国际环境计划（ＵＮＥＰ）１９９０年修改了蒙特利尔公约，要求在２０００年以前停止氟氯碳化合物（ＣＦＣ）的生产。因此，电子工业正在急切寻找不需用ＣＦＣ溶剂的替代清洗材料和助焊剂。经过电子工业在生产中评价后，低固态“免洗”助焊剂和有机水溶性助焊剂成为主流。对于这些类型的助焊剂，必须了解助焊剂的化学性质、焊接性、信赖性（可靠性）以及对于焊接过程的考虑。
United Nation Environmental Protection(UNEP)agency has revised the montreal protocol and demand that CFC products'production be terminated by year 2000.Therefore,the electronic industries are desperately searching for non ozone depleting cleaning solvents or soldering fluxes that do not require the use of CFC.After detail production evaluation by the industries,low solid no clean flux and water soluble soldering flux have become the main stream option.The throughout understanding of these fluxes'chemical & reliability properties is very crucial to the selection process.
出处
《电子工艺技术》
1997年第3期96-100,103,共6页
Electronics Process Technology
