大功率半导体激光器高可靠烧结技术研究

Investigation of High Reliability Sintering Technique for High Power Semiconductor Lasers

近几年大功率半导体激光器的应用领域越来越广,许多应用领域都要求半导体激光器能够高可靠性工作。工作焊接质量直接影响着大功率半导体激光器的可靠性,焊接缺陷会导致激光器迅速退化。目前国内普遍采用的铟焊料和锡铅焊料都是软焊料,焊层有形成晶须和热疲劳等可靠性问题。为提高烧结可靠性,采用了金锡焊料烧结激光器新技术。金锡焊料是硬焊料,焊接强度高,抗疲劳性好,对金层无浸蚀现象。通过实验研究掌握了金锡焊料的制备和烧结技术,并与铟焊料、锡铅焊料进行了对比实验。实验结果显示采用金锡焊料烧结激光器可获得更好的性能,是提高半导体激光器可靠性的有效途径。

High power semiconductor lasers are used widely. High reliability is needed by the related application fields. Welding quality directly affects reliability of high power semiconductor lasers. Welding defect may lead to rapid degradation of the lasers. In and Pb/Sn solders adopted commonly in China are both soft solders, Soft solders exist reliability problems, such as whiskers growth and thermal fatigue. In order to improve reliability of sintering, a new technique of sintering laser with Au/Sn solder was adopted. The strength and fatigue properties of the hard Au/Sn solder are better than soft solders, and Au/Sn solder scarcely etches the gold layer. The technology of manufacturing Au/Sn solder and sintering were mastered by experiment research, The characteristic differences among Au/Sn, In and Pb/Sn solders were studied with experiments. The experiment results show that the lasers sintering with Au/Sn solder can obtain better capability than others, The technique of sintering with Au/Sn solder is an effective way to improve reliability of semiconductor laser.