BGA器件焊接合格率的预测模型

Modeling and Predicting Solder Yield of Ball Gray Array

在表面贴装技术(SMT)大规模生产过程中,如果能够对焊接合格率进行预测,无疑对提高SMT产品的生产率、产品可靠性及成本控制具有重要意义。以球栅阵列(BGA)器件为例,研究SMT焊接合格率的预测方法。通过统计分析,结合焊点成形软件的方法,建立了BGA器件焊接合格率的预测模型,运用该模型可以找出影响焊接合格率的制约因素。结合仿真技术模拟焊点形态,发现引起焊接缺陷各参数之间的关系,并提出相应的解决方案。

Solder joints quality is critical to electronic package performance and service life, this problem is more important during the last decade with the switch to surface mount technologies from throughhole assembly. The reliability and manufacturing quality of BGA component solder joints directly impact the product quality. During the BGA processing, the variations of manufacturing process, component and PCB （print circuit board） parameters directly result in the variation of solder joint geometric parameters. In terms of statistical parameters unavoidable introduced by surface mount manufacturing, assembly process, component and PCB, an analytical modeling were developed to predict BGA solder yield performance, identify the relationship of design and process parameters, find the root cause of solder defects, and improvement of process parameters integrated with software simulation was suggested. The approach focused on BGA component solder joint, but the methodology was applicable to other SMT components.