期刊文献+

导热PE-HD/SiC复合材料的制备及性能研究 被引量:2

Preparation and Properties of Thermal Conductive PE-HD/SiC Composites
下载PDF
导出
摘要 将碳化硅(SiC)粒子和高密度聚乙烯(PE-HD)经粉末混合后制得导热复合材料。研究了 SiC 粒子分散状态及含量对复合材料热导率、热阻、力学性能及电绝缘性能的影响,探讨了 SiC 粒径对热导率的影响。结果表明:复合材料中 SiC 粒子围绕在 PE-HD 粒子周围,形成了特殊的网状导热通路;随 SiC 粒径增加,热导率降低;在填料体积分数为30%时,复合材料热导率、热阻、拉伸强度及冲击强度、体积电阻率和介电常数分别为1.05W/(m·K)、0.75K/W、15MPa、13.2kJ./m^2、4.6×10^(15)Q·cm 和3.03。此外,使用少量的氧化铝(Al_2O_3)纤维替代 SiC 组成混杂填料增强的材料各项性能均得到改善,并且与纯 PE-HD 相比具有优良的热传导能力。 A thermal conductive plastic composite was prepared from a particle mixture of silicone carbide (SIC) and high-density polyethylene (PE-HD). The effects of the particle sizes of SiC and its dispersion and content on thermal conductivity and other properties of the composites were investigated. It was found that SiC particles formed a network which acted as a conductive pathway. Thermal conductivity of the composites decreased with increasing particle size of filler. When the volume fraction of SiC was 30 %, the thermal conductivity, thermal resistance, tensile strength, impact strength, volume resistivity, and dielectric constant of the composites were 1.05 W/(m· K), 0.75 K/W, 15 MPa, 13.2 kJ/m^2, 4.6 × 10^15 Ω ·cm and 3.03, respectively. In addition, using small amount of alumina short fiber to replace SiC, the composites exhibited improved overall properties compared with pure PE-HD.
出处 《中国塑料》 CAS CSCD 北大核心 2007年第7期10-14,共5页 China Plastics
关键词 高密度聚乙烯 碳化硅 热导率 high density polythylene silicone carbide thermal conductivity
  • 相关文献

参考文献12

  • 1马传国,容敏智,章明秋.导热高分子复合材料的研究与应用[J].材料工程,2002,30(7):40-45. 被引量:103
  • 2Kondo Toshiki. Polyamide Composition for Housing of Electronic Parts[ P]. JP: 0379666,1991-04-04.
  • 3Kikuma Shinji. Highly Thermally Conductive Heat-resistant Thermoplastic Resin Composition for Metal Printed Circuit Boards[P]. JP:02110125,1990-04-23.
  • 4汪雨荻,周和平,乔梁,陈虎,金海波.AlN/聚乙烯复合基板的导热性能[J].无机材料学报,2000,15(6):1030-1036. 被引量:68
  • 5Agari Y, Ueda A, Nagai S. Thermal Conductivity of Composites in Several Types of Dispersion Systems[J]. Journal of Applied Polymer Science, 1991,42(6) : 1665- 1669.
  • 6Yu S Z, Hing P, Hu X. Thermal Conductivity of Polystyrene-Aluminum Nitride Composite [ J ]. Composites Part A, 2002, 33(5) :289-292.
  • 7He Y, Moreira B E, Overson A. Thermal Characterization of an Epoxy-based Underfill Material for Flip Chip Packaging [J ]. Thermochim Acta, 2000,14 : 1 - 8.
  • 8Agari Y, Ueda A, Nagai S. Thermal Conductivity of Polymer Composites[ J ]. Journal of Applied Polymer Science, 1993,49 (9) :1625-1634.
  • 9Agari Y, Ueda A, Nagai S. Thermal Conductivity of A Polyethylene Filled with Disoriented Short-cut Carbon Fibers[J]. Journal of Applied Polymer Science, 1991,43 (6) : 1117-1124.
  • 10Nasr G R, Badawy M M. Thermal Properties of Ceramicloaded Conductive Butyl Rubber Composites [ J ]. Polymer Degradation and Stability, 1995,47 (4) : 391 - 395.

二级参考文献6

共引文献150

同被引文献44

  • 1周文英,齐暑华,邵时雨,吴有明.HDPE/BN复合材料的热导率[J].合成树脂及塑料,2007,24(1):68-71. 被引量:12
  • 2邵建军,张平,唐幸福,张保才,宋巍,徐奕德,申文杰.制备方法及焙烧温度对Co_3O_4/CeO_2催化剂上CO低温氧化反应的影响[J].催化学报,2007,28(2):163-169. 被引量:19
  • 3肖春来.转化催化剂硫中毒的原因和处理[J].辽宁化工,2007,36(9):609-610. 被引量:2
  • 4HAN Z, FINA A. Thermal conductivity of carbon nanotubes and their polymer nanocomposites: A review [J]. Prog Polym Sci, 2011, 36 (7): 914-944.
  • 5TAVMAN I H. Thermal and mechanical properties of alumi- num powder-filled high-density polyethylene composites [ J]. J Appl Polym Sci, 1996, 62 (12) : 2161-2167.
  • 6KUMLUTAS D, TAVMAN I H, COBAN M T. Thermal conductivity of particle filled polyethylene composite materials [J]. Compos Sci Technol, 2003, 63 (1): 113-117.
  • 7ZHOU W. Thermal and dielectric properties of the aluminum particle reinforced linear low-density polyethylene composites [J]. PolymEngSci, 2011, 51 (5): 917-924.
  • 8LUYT A S, MOLEFI J A, KRUMP H. Thermal, mechanical and electrical properties of copper powder filled low-density and linear low-density polyethylene composites [J] Polym Degrad Stab, 2006, 91 (7) : 1629-1636.
  • 9RUSU M, SOFINA N, RUSU D, et al. Properties of iron powder filled high density polyethylene [J]. J Polym Eng, 2001, 21 (5): 469-487.
  • 10KUMLUTAS D, TAVMAN I H. A numerical and experi- mental study on thermal conductivity of particle filled polymer composites [J]. J Thermoplast Compos Mater, 2006, 19: 441-455.

引证文献2

二级引证文献9

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部