摘要
简要介绍了无铅焊接工艺的导入特点和与传统锡铅焊接工艺的主要区别,并对LCD行业的产品细间距引线焊接提出了多种工艺实现方法,同时指明了LCM实现无铅细间距焊接的工艺保证措施和改进方法。
Describe lead- free bonding technics,and the main differences as compareed with tin - lead bonding technics, put forward much method for small space bonding in LCD industry, and point out technical measures and method for improving lead -free and little space bonding in LCM.
出处
《电子工艺技术》
2007年第4期195-197,共3页
Electronics Process Technology
关键词
无铅工艺
细间距焊接
LCD应用
Lead - free bonding technics
Micro - space bond
LCD
Application
