封装测试后序先发

Back-end Test & Assembly Can Lead Upfront

封装测试传统上是看作后工序制造,可是随着半导体产业的发展,以满足消费者要求更小、更轻、更高及更多性能的电子产品,封装须与硅芯片研发及实际应用同步进行;甚或在手机等便携产品领域,封装测试要走在前列,才更能配合市场的发展需求。安森美半导体将与大家分享这封装测试发展的新思维,并希望能为封装测试产业作为中国整体半导体产业的发展取得更大的政策支持。

Test and assembly is traditionally viewed as back-end processing. With the advancement of semiconductor industry to satisfy consumers＇ demands for smaller, lighter and more advanced electronic products with increasing functionalities, assembly involving packaging should progress at the same time as the silicon chip design that caters for actual applications. In portable applications such as cell phones, test and assembly may have to lead the pack, to better support the market developments. ON Semicon- ductor will share this new idea on test and assembly in the article, and hopes to generate more discus- sions to facilitate even more policy support for the test and assembly industry in China, as part of the country＇s semiconductor industry development.