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Sn-9Zn钎料与内加Cu质点和Cu基体界面生长行为 被引量：3

Interfacial growth behavior of Sn-9Zn/additive Cu-particles and Sn-9Zn/Cu-substrate
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摘要 在Sn-9Zn无铅钎料中加入Cu金属质点,研究在长时间钎焊条件下钎料/Cu质点、钎料/Cu基体界面金属间化合物(IMCs)的生长行为。结果表明:在钎料/Cu质点和钎料/Cu基体界面处都生成Cu-Zn相(IMCs),其组成为Cu5Zn8+CuZn或Cu5Zn8,而且钎料/质点界面处IMCs的生长速度明显快于钎料/基体处;同时发现,Cu质点的加入大大减小了钎料/Cu基体界面IMCs的厚度。由于Cu质点原位生成Cu-Zn IMCs,消耗了焊点中的Zn,因此Sn-9Zn/Cu接头的可靠性得以提高。 The growth behavior of interfacial intermetallic compounds （IMCs） of Sn-9Zn/additive Cu-particles and Sn-9Zn additive Cu-substrate was investigated under the condition of extended soldering time. The results show that the Cu-Zn phases, which are composed of CusZn8 and CuZn or CusZn8, are formed at the interfaces of both Sn-9Zn/Cu-particles and Sn-9Zn/Cu-substrate, simultaneously the growth rate of IMCs of Sn-9Zn/Cu-particles is markedly higher than that of Sn-9Zn/Cu-substrate. It is also shown that the addition of Cu-particles in Sn-9Zn solder greatly reduces the thickness of 1MCs layer of Sn-9Zn/Cu-substrate. The reliability for Sn-9Zn/Cu joint is improved for the diminished Zn content in soldering joint due to the in-situ formation of IMCs of Sn-9Zn/Cu-particles.
作者 卫国强 况敏 杨永强 赵利
机构地区 华南理工大学机械工程学院 广州有色金属研究院材料表面中心
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2007年第7期1083-1089,共7页 The Chinese Journal of Nonferrous Metals
关键词 SN-9ZN钎料 无铅钎料 Cu质点 金属间化合物 Sn-9Zn solder lead-free solder Cu-particle intermetallic compound （IMCs）
分类号 TG454 [金属学及工艺—焊接]
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参考文献18

  • 1Laurila T,Vuorinen V,Kivilahti J K.Interfacial reactions between lead-free solders and common base materials[J].Mater Sci Eng R,2005,R49:1-60.
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二级参考文献17

  • 1[10]Knott S. Thermodynamic properties of liquid Al-Sn-Zn Alloys: a possible new lead-free solder material[J]. Mater Trans, 2002, 43: 1868-1872.
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共引文献36

同被引文献75

引证文献3

二级引证文献3

中国有色金属学报
2007年 第7期

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