硫酸镍体系中电解铜箔镀镍的动力学研究

Kinetic Investigation of Nickel Plating of Electrolytic Copper Foil in the System of NiSO_4 Solution

通过电化学测试方法,初步探讨了硫酸镍体系中电解铜箔镀镍的某些动力学问题。结果表明,镍阴极电沉积的Tafel斜率为0.106 V,表观传递系数为0.58,交换电流密度为1.14×10-7A/cm2,电极反应表观活化能为61.1 kJ/mol。在0.5～0.6 V的电位范围内,第一电子传递反应为电极反应的速度步骤控制,而在较高的阴极极化电位下,镍电沉积是混合步骤控制。

Electrochemical method was used to simply investigate some kinetic questions of the Nickel plating of electrolytic Copper foil in the system of NiSO4 solution. The results were indicated as follows： Tafel slope was 0. 106 V ; apparent transfer coefficient was 0.58 ; exchange current density was 1.14×10^-7 A/cm^2, electrode reaction apparent activation energy was 61.1 kJ/mol. The first electron transfer reaction was the rate - determining step in the range of voltage from 0.5 - 0.6 V, however the electron reaction was controlled by mixed step when cathodic electron polarization potential was made more negative.