钨铜合金化学镀镍磷镀层腐蚀行为的研究

On Corrosion Behavior of Ni-P Deposit on W-Cu Alloy

采用浸渍失重试验法和动电位极化曲线研究了钨铜合金镀层基材和钨铜合金表面化学镀Ni-P合金镀层在不同腐蚀介质溶液中的腐蚀行为。结果表明:化学镀Ni-P合金在质量分数为3.5%NaCl溶液、人工模拟汗液和体积分数为10%H2SO4溶液中的耐蚀性能好于钨铜合金;化学镀Ni-P合金浸入质量分数为3.5%NaCl溶液后其表面便开始形成钝化膜,但此钝化膜不完整,随着浸泡时间的延长,钝化膜不断生长,能在较长时间内(29d)对钨铜合金起到保护作用。

The corrosion behavior of Ni-P deposit on W-Cu alloy in different corrosion solution was tested by weight loss test and the polarization curves. The weight loss tests indicate that the anti-corrosion ability of Ni-P deposit in 3.5% NaCl solution, self-made sweat solution and 10% H2SO4 solution was better than that of W-Cu alloy. The polarization curves indicate that the passive membrane began to generate not long after the electroless Ni-P deposit was immersed in NaCl solution, though it was not integrated. With the lengthening of immersion time the passive membrane becomes integrated and it can offer protective layer to W-Cu alloy in as long as 29 days.