空调器印刷电路板(PCB)无铅焊点寿命评估研究

Life Assessment for lead-free joint of Air-conditioner PCB

由于无铅焊料的应用,无铅焊点的可靠性问题得到了关注。本文针对无铅焊点的空调器印刷电路板(PCB),结合实际使用条件,采用加速寿命的方式,测试了焊点的寿命。并针对温度循环条件下的焊点,使用有限元模拟技术计算测定了其寿命,并与实验的结果进行了比较,取得了较吻合的结果。

As the application of lead-free solder, the reliability of solder joint causes attention. Against lead-free solder joint of air-conditioner PCB, the life of solder joint is test and measurement according to speeding up life way based use condition. FEM is applied to calculate the life of solder joint under the condition of thermal recycle. The result of FEM is similar to the test.