印制电路板镀通孔制程可靠性问题与研究技术途径

Identifying Issues of Plated-Through Hole Manufacturing Reliability for PCB and Approaches for Studying

影响镀通孔制程可靠性因素众多,关系复杂,需要一个有效的技术途径来研究该问题。文中总结了印制电路板镀通孔制程的各个加工步骤和工序的目的,以及制造过程中影响这些目的达成效果的影响因素。分析汇总了印制电路板镀通孔的各种失效模式和机理,及其对应的失效发生的部位和影响因素。在此基础上,明确了进行印制电路板镀通孔制程可靠性研究的技术途径,同时给出了实施这项研究的技术细节。

Manufacturing quality and workmanship is a key factor to the reliability of plated though holes （PTH） in primed circuit boards （PCB）. To conduct a study and investigate the factor needs to idemify and have an in-depth understanding of manufacturing reliability associated issues and determine an effective approach to implement the study. For this reason, this paper summarizes major manufacturing processes of PTHs. It provides a review of failure modes, mechanisms and locations that are associated with PTH manufacture processes. In this end, this paper provides an approach and necessary information for effectively conducting an experimental and theoretical research on PTH manufacture reliability.