摘要
在最近几年中,无源嵌入式器件技术的发展成了OEM厂商,板材制造商和材料供应商所共同关注的事情。移动电话等不断追求小型化便携式的器件的需求,首先带动了这种技术的发展,通过无源嵌入式器件的优势也渐渐被大家所认识。DuPont专注于无源嵌入式器件在应用于有机衬底的电阻和电容材料领域取得了很大的成就。产品的家族包括了广泛的领域,即陶瓷、厚膜聚合物和用于贴装用的嵌入式器件的浆料,为了满足平面电容的要求而填充和非填充有机电解质的电容器。此前研究的文章描述了涉及到标准厚膜和在印制板上嵌入无源厚膜陶瓷电容器的印制电路板制程的技术发展。而这篇文章将重点放在嵌入式厚膜陶瓷电容器的可靠性上。
Technology development for embedding of passive components has been the subject of significant focus for OEMs,board fabs and material suppliers for the past few years. This has been driven primarily by the need to miniaturize portable devices like mobile phones though performance advantages accruing from embedding passives is also becoming increasingly significant.
DuPont＇s focus in the area of Embedded Passives. The product family includes a wide range of materials viz. ceramic and polymer thick-film capacitor and resistor pastes for discrete embedded devices and filled and unfilled organic laminates for applications requiring planar capacitance. Previous publications have described the technology development involving standard thick-film and printed wiring boards （PCB） processes to embed thick-film ceramic passives in PCBs. This paper focuses on reliability of embedded thick film ceramic capacitors.
出处
《印制电路信息》
2007年第8期38-43,共6页
Printed Circuit Information
关键词
嵌入元件
陶瓷电容器
可靠性
embedded components
ceramic capacitors
reliability
