摘要
低温无铅焊料是实现无铅化应用的关键因素之一,目前国外正在加紧这方面的研究。文章以日本为例,介绍低温无铅焊料的技术课题与开发方向。
The lead-free solder of low temperature is achieves lead-free application key-aspects, the overseas is hard studying in this aspect at present. This article take Japan as an example, introduce technical topic and development direction of low temperature lead-free solder.
出处
《印制电路信息》
2007年第8期64-68,共5页
Printed Circuit Information
关键词
无铅焊料
低温安装
技术课题
发展趋势
lead-free solder
low temperature installment
technical topic
development tendency
