摘要
阳极键合技术在几十年来得到了很大的发展。随着其使用范围的扩大和对键合强度要求的提高，对基片材料提出了新的要求。微晶玻璃是一种性能优异的材料，如果能与不锈钢进行键合，将在微机电系统得到广泛的应用。论文在前期工作的基础上分别对微晶玻璃的核化和晶化温度进行了系统研究，通过XRD，SEM及相关的测试手段，分析讨论了热处理温度对主晶相、晶粒尺寸大小、析晶程度及其相关性能的影响。实验结果表明，样品的主晶相为Li2SiO3，合适的核化温度范围为450～630℃，晶化温度范围为670～760℃，样品的最大抗折强度为95．38MPa。
Anodic bonding technology was improved greatly in Micro Electromechanical System （MEMS） during the previous several decades. Now, this technology is used widely but the higher bonding strength is definitely required. Glass - ceramics have good performances. If bonding with stainless steel can be realized, it can be sure that they will be used much more widely in microelectromechanical systems. The nucleation temperature and crystallization temperature of the glass -ceramics were investigated. XRD, SEM and other testing methods were used to measure the performances of the glass - ceramics. The results showed that the major crystalline phase was LizSi03, the proper nucleation temperature was between 450℃ and 630℃, the optimum crystallization temperature was between 670℃ and 760℃ and the maximum bending strength of the test specimens was 95.38 MPa.
出处
《玻璃与搪瓷》
CAS
2007年第4期1-5,共5页
Glass & Enamel
基金
国家自然科学基金资助项目(50472039)
湖北省自然科学基金资助项目(2005ABA011)
关键词
微晶玻璃
阳极键合
核化温度
晶化温度
glass - ceramics
anodic bonding
nucleation temperature
crystallization temperature
