聚酰亚胺低介电常数材料的研制

Development of Low ε Polymide Materials

以均苯四甲酸二酐、二胺基二苯醚、乙酰胺及纳米SiC颗粒为原料,经加热固化等工艺,制备了低介电常数和低吸水性的聚酰亚胺基复合材料。这种复合材料是纳米小颗粒均匀分散到聚酰亚胺聚合物大分子空间,形成了网络状杂化复合体系,材料的介电常数低达2.2,化学抗湿性能为0.6%。

Low dielectric constant ε and low hygroscopicity polymide composite is prepared from the raw materials of PMDA, DDA, dimethyl acetamide and nanometer silicon carbide by heating, curing and other processes. In this compound material, the small nanometer particles are evenly dispersered into the space of big polymide polymer molecules to form the network shape hybridization compound system. The low ε of this material reaches as low as 2.2, the moisture absorption performance is 0.6%.