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借助硅片减薄重掺硅间隙氧含量低温(10K)红外测量 被引量:1

Low Temperature 10K Infrared Measurement of Interstitial Oxygen in Heavily-Doped Silicon Via Wafer Thinning
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摘要 本文首次报道了一种新颖的重掺硅中间隙氧含量测量技术,通过硅片减薄并采用低温红外透射测量,明显降低了重掺硅自由载流子吸收的严重干扰,提高了红外吸收峰信噪比,在1136cm-1附近得到了明显的Si-O键红外吸收峰,从而可以准确地测量重掺硅间隙氧含量.实验结果表明:该测量方法具有很高的测量准确度和更宽泛的电阻率应用范围.对于重掺n型硅,其测量应用范围可扩展至电阻率1×10-2Ω·cm(自由载流子浓度高达4×1018cm-3). A new technique is reported for rapid determination of interstitial oxygen(Oi) inheavily Sb-doped CZ silicon. This technique includes the application of wafer thinning andlow temperature (10K) FTIR transmittance to measure Si-O infrared absorption bandaround 1136cm-1. Mechanical wafer thinning combined with 10w temperature FTIR canmarkedly reduce the frequency-independent absorption by excess free carriers and increase the intensity of transmitted light. As a result, a high signal-to-noise ratio for Oi infrared absorption band is attained. Our results show that this method has a high reliabilityof measurement and can.be used at resistivity down to 0. 01Ω· cm for n-type heavily Sbdoped (up to 4×1018cm-3) silicon.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 1997年第8期587-591,共5页 半导体学报(英文版)
关键词 半导体 间隙氧含量 红外吸收 重掺硅 Infrared radiation Low temperature operations Semiconductor doping Signal to noise ratio Thin films
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参考文献2

  • 1王建华,Proceedings of ICMPC’94 Conference,1994年
  • 2马震宇,半导体学报,1994年,15卷,3期,217页

同被引文献2

  • 1王启元,半导体学报,1997年,18卷,8期,588—591页
  • 2He Huannan,Talanta,1983年,30卷,10期,761页

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