4Biocca Peter. Tin-copper based solder options for lead-free assembly [J]. Global SMT & Packaging, 2006(11/12) : 23 - 25.
5Blattau N, Hillman C. A comparison of the isothermal fatigue behaviorof Sn-Ag-Cu to Sn-Pb solder[C]// Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb. IPC/APEX, Anaheim, CA, 2006:7 - 10.
6Chen Z G, Shi Y W, Xia Z D, et al. Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints[ J]. Journal of Electronic Materials, 2002, 31 (10) : 1122 - 1128.
7史耀武.材料焊接工程(上)--中国材料工程大典:第22卷[M].北京:化学工业出版社,2006.
8PRZEMYSLAW M, JAN E Influence of solder joint constitution and aging process duration on reliability of lead-free solder joints under vibrations combined with thermal cycling [C]// Proceedings of 3rd Electronics System Integration Technology Conference. Piscataway, USA: IEEE Computer Society, 2010.
9QI H Y, MICHAEL O, MICHAEL P. A rapid life-prediction approach for PBGA solder joints under combined thermal cycling and vibration loading conditions [J]. IEEE Trans Compon Packg Technol, 2009, 32(2): 283-292.