期刊文献+

新型光纤连接器端面研磨抛光机的运动分析 被引量:1

Analysis on the Kinematics of a New Lapping and Polishing Machine for the Fiber Optical Connector End Surface
下载PDF
导出
摘要 设计一种新型的光纤连接器端面研磨抛光装置,建立该机构的运动学方程。从机构的运动角度出发,借助MATLAB语言,对该机构的运动轨迹进行仿真研究,找出影响此种机构的重要参数,总结出主要参数的变化对研磨盘运动的影响。研究结果证明此种研磨机构理论上能够较好地完成光纤连接器端面的研磨。 This article has done systematic research to the fiber optic connector end surface manufacture method, a kinematics model of new lapping and polishing machine is developed. From the organization movement tangle, using the MATLAB language to conduct the simulation research to this organization path, discovered this kind of organization's important parameter,and summarized the influence of the main parameter's change to the movement of grinding wheel.The result proved this kind of grinding installment can complete the grinding to the fiber optic connector end surface better in theory.
出处 《机械工程师》 2007年第8期38-40,共3页 Mechanical Engineer
关键词 光纤微透镜 研磨 运动仿真 lapping and polishing optical fiber connector material removing rate(MRR) uniformity
  • 相关文献

参考文献12

  • 1马天,黄勇,杨金龙.光纤连接器[J].光学技术,2002,28(2):160-162. 被引量:19
  • 2李国正,刘淑萍.光纤/波导器件/光纤系统的损耗分析[J].应用光学,1995,16(1):23-25. 被引量:6
  • 3Rosa M D,Carberry J,Bhagavatula V,etal.Highpower performance of single mode fiber-opticconnectors[J].Journal of Lightwave Technology,2002,20(5):879-885.
  • 4Takahashi M.Elastic polishing plate method and conditions for forming angled convex surface on ferrule end face[J].Journal of Lightwave Technology,1997,15(9):1675-1680.
  • 5Lin Si-En.Effect of polishing conditions on terminating optical connectors with spherical convex polished ends[J].Applied Optics,2002,41 (1):88-95.
  • 6刘德福,段吉安.光纤端面研磨加工机理研究[J].光学精密工程,2004,12(6):570-575. 被引量:21
  • 7Ardeltt U.Influence of kinematics on the face grinding process on lapping machines[J].Annals of the CIRP,1999,48 (1):281 -284.
  • 8Tso P.L.,Wang Y.Y.and Tsai M.J.,A Study of Carrier Motion on a Dual-face CMP Machine[J].Journal of Materials Processing Technology,2001,116:194-200.
  • 9Ling Yin,Han Huang,et al.Influences of nanoscale abrasive suspensions on the polishing of fiber-optic connectors[J].Int.J.Adv.Manuf.Technol,2004,23.
  • 10Gharbia Y A.Nano-grinding for Fabrication of Micro-lenses on Optical Fiber End faces[D].New South Wales:School of Mechanical and Manufacturing Engineering,The University of New South Wales,Desertation,2003.

二级参考文献13

  • 1佐佐木重夫.微分几何学[M].上海:上海科学技术出版社,1963..
  • 2-.光纤连接器需求呈二位数增长[J].国际电子商情,1999,(6):1-1.
  • 3UDREA M, ORUN H, ALACAKIR A. Laser polishing of optical fiber end surface[J]. Optical Engineering, 2001, 40(9): 2026-2030.
  • 4BIFANO T G, DOW T A, SCATTERGOOD R O. Ductile-Regime grinding: A new technology for machining brittle materials[J]. Journal of Engineering for Industry, 1991, 113(5): 184-189.
  • 5SINHOFF V. Generative precision grinding of optical glass[J]. Annals of CIRP, 1998, 47(1): 253-258.
  • 6ONG N S, VENKATSH V C. Semi-ductile grinding and polishing of Pyrex glass [J]. Materials Processing Technology, 1998, 83: 261-266.
  • 7TAKAHASHI M. Elastic polishing plate method and conditions for forming angled convex surface on Ferrule End-face[J]. Journal of Lightwave Technology, 1997, 15(9): 1675-1680.
  • 8LIN S I-EN. Effect of polishing conditions on terminating optical connectors with spherical convex polished ends[J]. Appl. Opt., 2002, 41(1): 88-95.
  • 9SHINTAKU T, SUGITA E, NAGASE R. Highly stable physical-contact optical fiber connectors with spherical convex ends[J]. Journal of Lightwave Technology, 1993, 11(2): 241-248.
  • 10XIE Y, BHUSHAN B. Effect of particle size, polishing pad and contact pressure in free abrasive polishing[J]. Wear, 1996, 200(1-2):281-295.

共引文献64

同被引文献13

  • 1扎齐斯基.玻璃与非晶态材料[M].北京,科学出版社,2001.330.
  • 2PRETON F W. Glass Technology[ J]. Journal of the Societyof Glass Technology, 1927 ,11 :277-281.
  • 3LI Jing. Material Removal Mechanism of Copper CMP froma Chemical-mechanical Synergy Perspective [ J ]. TribologyLetters,2013,49 :11-19.
  • 4CHOI S. A Model of Material Removal and Post ProcessSurface Topography for Copper CMP [ J ]. Procedia Engi-neering, 2011 ,19 :73-80.
  • 5HOPCROFT M. What is the Young, s Modulus of Silicon[J ]. IEEE Journal of Micro Electromechanical Systems,2010,19(2) :229-238.
  • 6HXUMYV W. Analyses and Experimental Confirmation ofRemoval Performance of Silicon Oxide Film in the Chemi-cal-mechanical Polishing ( CMP) Process with Pattern Ge-ometry of Concentric Groove Pads[ J]. Wear,2011 ,270(3/4):172-180.
  • 7顾欣,张晨辉,雒建斌,路新春.石英光纤端面的化学机械抛光实验研究[J].摩擦学学报,2008,28(1):11-17. 被引量:5
  • 8郁炜,吕迅,楼飞燕.CMP加工过程中抛光速度对液膜厚度的影响分析[J].轻工机械,2008,26(6):97-99. 被引量:2
  • 9陈晓苹,王朋,李俊峰,宣斌,宋淑梅,谢京江.玻璃质光学元件表面微裂纹的研究[J].中国光学与应用光学,2010,3(4):318-324. 被引量:10
  • 10计时鸣,李琛,谭大鹏,袁巧玲,池永为,赵凌寒.基于Preston方程的软性磨粒流加工特性[J].机械工程学报,2011,47(17):156-163. 被引量:65

引证文献1

二级引证文献3

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部