退火工艺对溶胶凝胶Pb(Zr_(0.52)Ti_(0.48))O_3薄膜残余应力的影响

Effect of annealing conditions on residual stress in sol-gel-derived Pb(Zr_(0.52)Ti_(0.48))O_3 film

使用溶胶凝胶法制备了Pb(Zr0.52Ti0.48)O3铁电薄膜,分别利用原子力显微镜、X射线衍射及面探扫描技术分析了薄膜的组织结构,并运用掠入射X射线衍射法研究了不同工艺条件下制备的薄膜的残余应力。研究表明溶胶凝胶薄膜在600℃退火30min后完全晶化,组织结构均匀。不同工艺下制备的薄膜均受残余拉应力,随着退火温度及退火时间的延长,薄膜中的残余应力逐渐增大,而随着薄膜厚度的增加,残余应力先增大然后减小。

Pb（Zr0.52Ti0.48）O3 ferroelectric thin films were prepared by a modified sol-gel process.The microstructures and compositions of the film were analyzed by atomic force microscopy and X-ray diffraction and two-dimensional diffraction technique,respectively.The residual stresses of the PZT films were measured by grazing incidence X-ray diffraction.The PZT films were smooth with low roughness,and were well crystallized by annealing at 600℃ for 30min.The XRD results showed that sol-gel PZT films were in tension;and the residual stresses in PZT film increased with growing annealing temperature and annealing interval;and that with the increasing of film thickness, the residual stress firstly increased and then decreased in thicker film.