(SiC)_P表面修饰和表征及动力学分析

Surface decoration characterizations and kinetics analysis on (SiC)_P

利用简单的化学镀技术,通过改进前处理工艺,对(SiC)p进行低成本的表面修饰,获得了镀层连续,无光滑(SiC)P裸露的较高质量的改性碳化硅复合粉体[简写为(Ni/SiC)P]。SEM、EDS、XRD测试结果表明,修饰后的(Ni/SiC)P较修饰前的(SiC)P导电性提高,形貌、组成、结构发生改变。同时对(SiC)P表面修饰的动力学机理给出初步分析,并尝试给出该过程的碰撞速率方程。

Surface of（SiC）p was decorated at low cost by simple electroless plating,improved the technology of pre-treatments and produce continual,non-lubricous and high quality decoration of（SiC）P[abbreviate as（Ni/SiC）P].Experiment results of SEM,EDS,XRD indicated that the electric functions of（Ni/SiC）P was much higher than those of unembellished（SiC）P,in respect of form,facial look and structure changed.It＇s also analyzed that the（SiC）P surface decoration kinetics principium,presented that（SiC）P surface decoration collide velocity equation.