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基于LTCC技术的蓝牙巴伦设计 被引量:18

Design of Bluetooth Balun Fabricated by Low Temperature Co-fired Ceramic
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摘要 介绍了一种新型贴片式多层陶瓷巴伦。该巴伦是基于LTCC(Low Temperature Co-fired Ceramic,低温共烧陶瓷)技术设计的新型多层结构巴伦,采用独特的螺旋线宽边耦合带状线结构(SBCS),并且增加了端电容,极大地缩小了巴伦尺寸。设计的巴伦频率范围为2.4~2.5GHz,具有尺寸小、插损低、平衡度好等优点,并且工艺敏感度低,可应用于蓝牙通讯系统。文章讨论了其小型化思路与方案,描述了所设计巴伦的3D结构,给出了设计仿真结果与实验结果,两者吻合较好。 A chip-type multi-layer ceramic balun is presented in this paper. This balun is fabricated using LTCC ( Low Temperature Co-fired Ceramic) technology, and it is designed using new multilayer structure with Spiral Boardside Coupling Stripline(SBCS) which contributes dramatically to the reduction of the dimension. Its frequency range is 2.4GHz-2.5GHz, with small size, low insertion loss and good amplitude balance. This design is not sensitive to processing, and can be applied to Bluetooth communication. How to reduce the size is discussed in this paper,and the 3D structure is presented. And the results of computer simulation is presented, as well as the measured, and they show a good agreement.
出处 《微波学报》 CSCD 北大核心 2007年第4期55-57,共3页 Journal of Microwaves
关键词 低温共烧陶瓷(LTCC) 巴伦 多层陶瓷 蓝牙 Low temperature co-fired ceramic ( LTCC ); Balun; Muhilayer ceramic; Bluethooth
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参考文献6

  • 1Lim H A,Leong M S,Ooi B L,Chew S T.A new method of designing marchand balun for multilayer applications.APMC 2001,Taiwan,2001.
  • 2Rogers J,Bhatia R.A 6 to 20 GHz planar balun using a Wilkinson divider and Lange couplers.1991 IEEE MTT-S Int Dig,1991.865-868.
  • 3Tang C W,Sheen J W,Chang C Y.Chip-type LTCC-MLC baluns using stepped impedance method.IEEE Trans Microwave Theory Tech,2001,49(12):2342-2349.
  • 4Fujiki Y,Mandai H,Morikawa Takehiko.Chip type spiral broadside coupled directional couplers and baluns using low temperature co-fired ceramic.1999 IEEE Electronic Components and Technology Conference,1999.105-1 10.
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  • 6Tang Ching-wen,Chang Chi-Yang.A semi-lumped Balun fabricated by low temperature co-fired ceramic.2002 IEEE MTT-S Int Dig,2002.2201-2203.

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