摘要
根据真空断路器大功率、小型化发展趋势对触头材料的要求,探索用高能球磨制粉、热压烧结的方法制备微晶CuCr触头材料.结果表明,高能球磨能够制备出超细晶Cu-Cr合金粉.750℃热压时材料仍保持合金粉形貌,颗粒内发生部分过饱和固溶Cu与Cr的时效析出过程.920℃热压时Cu与Cr组元重新分布并发生了再结晶过程,晶粒尺寸为2~3μm,远远小于常规方法生产的CuCr材料.由于微晶CuCr材料中Cr相固溶度升高,使材料电击穿机制发生变化,首次击穿相从常规材料中的Cr相转移到Cu相上.
The contact materials have to be developed for the requirement of vacuum interrupters which tend to be high power and compact. CuCr alloys prepared by high energy ball milling and hot press were investigated in this paper. The experiment results show that the ultra fine Cu Cr alloy powders can be got by high energy ball milling. The alloy remained the powder morphology when hot press was taken at 750℃, but the saturated Cu phase and Cr phase precipitated partly; The element Cu and Cr would redistribute and the recrystallization took place when hot press at 920℃; The grain size of these alloys is 2~3μm, much smaller than that of general CuCr contact materials. The breakdown mechanism changed for the excess solubility of Cr phases, the first breakdown took place on Cu phases.
出处
《西安交通大学学报》
EI
CAS
CSCD
北大核心
1997年第3期76-80,91,共6页
Journal of Xi'an Jiaotong University
基金
国家自然科学基金
关键词
电击穿
真空断路器
铜合金
触头材料
制备
micro grain CuCr contact materials high energy ball milling heat press electrical breakdown