摘要
步进扫描光刻机是半导体制造行业的关键设备,在这种光刻机系统中,硅片台和掩模台要按照1∶4的速度比进行同步扫描运动,同步运动性能指标以移动平均差(MA)和移动标准差(MSD)来度量。扫描过程中的同步性能对光刻机最终能生产出的芯片特征尺寸有着很大的影响。文章对模拟硅片-掩模台同步运动的同步误差进行了分析,给出在一定的扫描速度下,不同频率范围的误差成分对MA和MSD的影响的规律,分析结果对于有针对性地提高同步性能指标具有一定的指导意义。
In the step ＆ scan lithography system, the wafer stage and reticle stage should scan simultaneously at a high speed and the speed ratio is 1： 4. The performance of synchronization in lithography is evaluated by MA and MSD. The synchronization error between the wafer and the reticle stages has much effect on the exposure quality of the wafer, such as CD. In this paper, the synchronization error is analyzed. In given scan speed, the relationship between the vibration spectrum and MA/MSD is expounded. The result may be helpful to provide new method to improve MA and MSD.
出处
《制造技术与机床》
CSCD
北大核心
2007年第9期42-43,47,共3页
Manufacturing Technology & Machine Tool
基金
国家"九七三"重点基础研究项目(2003CB716204
2004CB318007)
关键词
光刻机
同步扫描
误差分析
Lithography
Step and Scan
Error Analysis
