摘要
对Sn-9Zn-xCu钎料在3.5%NaCl溶液中的电化学腐蚀行为进行研究,以揭示添加Cu对Sn-9Zn钎料耐蚀性的影响。结果表明:添加Cu元素使Sn-Zn钎料的腐蚀电位有所增加,即添加Cu元素可以改善Sn-Zn钎料的耐腐蚀性能;XRD检测发现Sn-9Zn-xCu钎料的腐蚀产物中存在Zn5(OH)8Cl2.H2O;随着Cu含量的增加,Zn5(OH)8Cl2.H2O的量逐渐减少,出现Cu的腐蚀产物,腐蚀表面趋于均匀平整,选择性腐蚀减弱,腐蚀产物的黏附性较好。
The electrochemical corrosion behavior of lead-free Sn-9Zn-xCu（x=0-6） solder in 3.5% NaCl solution was studied, in order to reveal the effect of Cu on the corrosion resistance of Sn-9Zn solder. The results indicate that the corrosion potential increases with increasing the addition of Cu, so Cu can improve the corrosion resistance of Sn-Zn solders. XRD results indicate that Zn5（OH）8Cl2·H2O exists in the corrosion products of Sn-gZn-xCu. With increasing Cu content, the quantity of Zn5 （OH）8Cl2·H2O decreases, the corrosion products containing Cu form, the surface tends to be smooth, and the selective oxidation weakens.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2007年第8期1302-1306,共5页
The Chinese Journal of Nonferrous Metals
基金
辽宁省自然科学基金资助项目(20041078)
