流动槽滴入法电结晶制备铜钴纳米多层膜

Electrodeposited Cu / Co Nanomultilayers in flowing electrolyzing cell

在硼酸镀液体系中采用流动槽滴入法电结晶制得Cu/Co纳米多层膜,通过循环伏安法确定Cu、Co电结晶电位,分别为-0.55V和-1.05V(vs.SCE),通过X射线衍射技术(XRD)和X射线荧光光谱法(XRF)对Cu/Co纳米多层膜的结构、成份进行了分析。并用物性测量系统PPMS测试了Cu/Co多层膜的磁性能,结果表明:电结晶制备的Cu/Co多层膜的矫顽力比较小,仅为34 Oe,适合作巨磁阻磁头材料,其磁电阻随磁场强度的增大而减小,且约在3000 Oe时磁电阻趋于饱和,此时的巨磁阻效应GMR值达到了14%.

Cu/Co nanomultilayers were prepared by electrocrystallization in boric acid solution. By the cyclic voltammetry, the deposition and dissolving potential of Cu and Co have been determined. Cu deposition starts at -0.55V（vs. SCE）and Co deposition starts at- 1.05V（vs. SCE）. The structure and composition of the deposited muhilayers were studied by the XRD and XRF. The PPMS was used to characterize magnetic properties of the electrodeposited muhilayers . The results show that coercivity of the multilayers is only 34 Oe. The GMR value decreases when the magnetic intensity increases, and keeps steady when the magnetic intensity is about 3000 Oe. The GMR is up to 14 %.