苯乙烯-异戊二烯嵌段聚合物热熔压敏胶性能影响因素探讨

Study of Influencing Factor on the Properties of SIS Hot-melt Pressure Sensitive Adhesive

用不同种类增粘树脂、不同牌号苯乙烯-异戊二烯嵌段聚合物(简称SIS)制备SIS热熔压敏胶,考察不同种类增粘树脂、不同牌号SIS及萜烯树脂含量对SIS热熔压敏胶性能的影响,结果表明:萜烯树脂是改性SIS热熔压敏胶适宜的增粘树脂,当萜烯树脂在SIS热熔压敏胶中含量达50%时,SIS热熔压敏胶性能较佳,随不同牌号SIS中两嵌段SI含量的增加,SIS热熔压敏胶的剥离强度有所增加,持粘力有所下降。

In this paper, styrene-isoprene-styrene block copolymer （SIS） hot-meh pressure sensitive adhesive （HMPSA） was prepared using different kinds of tackifying resins and SIS. Effects of tackifying resins, SIS and the amount of terpene-resin on the properties of SIS HMPSA were studied. The results showed that terpene-resin was a suitable tackifying resin to modify SIS hot-meh pressure sensitive adhesive. When the content of terpene resin in SIS HMPSA reached to 50%, the properties were better. AS the content of SI diblock in SIS increased, the peeling strength of SIS HMPSA increased, but constant adhesion decreased.