螯合沉淀法处理电路板碱氨蚀刻废水

Treatment of alkali ammonia etching wastewater from printed circuit board production using chelation precipitation process

研究了环境友好型的有机硫螯合剂TMT处理电路板碱氨蚀刻废水的影响因素,用元素分析、红外与X衍射等手段表征了生成的沉淀产物,并对它的热分解性与在去离子水中的渗滤性作了初步探讨。结果表明,TMT能与铜离子强力螯合并沉淀,处理电路板碱氨蚀刻废水的效果好,废水的pH值为8,总铜的质量浓度为350.9mg/L,总氨质量浓度为349.4 mg/L,当TMT与Cu的量比为2.1:3时,上清液中残余铜的质量浓度为0.10 mg/L,铜去除率达99.97%。生成的沉淀物为非晶态的Cu3(C3N3S3)2.1.5H2O,它的热稳定性较高,在去离子水中渗滤出的饱和铜浓度很低,不会对环境造成二次污染。

The influencing factors of enviroment-friendly organic sulphur chelating agent TMT treating alkali ammonia etching wastewater from printed circuit board production were investigated,element analysis,infrared ray,X-ray diffraction were used to characterize the precipitate,and its thermal decomposition ability,and the permeabi-lity in deionized water were primarily discussed.The results showed that,TMT could strongly chelated copper ion and forming precipitation,which obtained good effect on treatment of alkali ammonia etching wastewater from printed circuit board production,the wastewater pH was 8,the mass concentration of total copper,total ammonia were 350.9 mg/L,349.4 mg/L respectively,when the TMC/Cu ratio was 2.1 ： 3,the residual copper in supernatant was 0.10 mg/L,the removal rate of copper reached 99.97%.The precipitate was amorphous Cu3（C3N3S3）2·1.5H2O,which featured with high thermal stability and very low saturated copper concentration in deionized water,therefore,it won′t cause secondary pollution on the environment.