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RE含量及环境条件对SnAgCu钎焊接头蠕变断裂寿命的影响 被引量:14

Effect of Ce-La Mixed Rare Earth Content and Environment Conditions on the Creep Rupture Life of SnAgCu Solder Joints
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摘要 采用搭接面积为1mm2的微型接头,研究了Ce-La混合稀土(RE)含量和环境条件对Sn2.5Ag0.7CuxRE钎料钎焊接头蠕变断裂寿命的影响。结果表明:添加微量RE可改变钎焊接头界面层金属间化合物的几何尺寸及形态,从而影响SnAgCuRE钎料合金钎焊焊点的蠕变断裂寿命。当RE添加量为0.1%时(质量分数,下同),焊点界面金属间化合物尺寸小且均匀,蠕变断裂寿命最长,为SnAgCu焊点蠕变断裂寿命的8.4倍,其值明显高于商用钎料Sn3.8Ag0.7Cu焊点的蠕变断裂寿命。在相同条件下,焊点的服役温度升高、应力增加,将导致焊点的蠕变断裂寿命下降。 In this paper the effect of Ce-La mixed RE content and environment conditions on the creep rupture life of Sn2.5Ag0.7CuxRE was studied using the single shear lap with a 1 mm^2 cross sectional area. The investigation indicates that adding tiny content of rare earth (RE) in Sn2.5Ag0.7Cu lead-free solder alloy can effectually affect the size and configuration of the intermetallic compound (IMC) of interracial layer, which determines the creep rupture life of SnAgCuRE soldered joints. When the RE-adding content in Sn2.5Ag0.7CuxRE solder alloy was 0.1wt%, the IMC of interracial layer was thinner and its thickness was homogeneous, and the creep rupture life of solder joints was the longest, which was 8.4 times longer than that of Sn2.5Ag0.7Cu solder alloy and much higher than that of commercially used Sn3.8Ag0.7Cu solder alloy. In the same environmental conditions, the creep rupture life of Sn2.5Ag0.7Cu0.1RE soldered joints sharply decreased with increasing of the temperature and stress.
机构地区 河南科技大学
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2007年第8期1473-1476,共4页 Rare Metal Materials and Engineering
基金 河南省高校创新人才基金(教高2004-294) 河南省高校杰出科研人才创新工程项目(2004KYCX020) 河南省杰出青年科学基金(074100510011) 河南省青年骨干教师资助项目([2002]114)
关键词 SnAgCu钎料 环境条件 钎焊接头 蠕变断裂寿命 SnAgCu solder alloy environment conditions solder joints creep rupture life
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