摘要
评述了线性电位扫描方法在电镀生产研究中的应用，对稳态极化曲线、循环伏安曲线所表示的意义以及电结晶过程、阳板溶解过程、欠电位沉积等的伏安曲线进行了讨论。
Applications of linear potential sweep method in electroplating research are introduced. The voltammetric curves of electrocrystallization, anodic dissolution and ullaged potential deposition phenomena as well as the information shown in the steady-state and cyclic voltammetric curves are studied.
出处
《电镀与涂饰》
CAS
CSCD
1997年第1期1-5,共5页
Electroplating & Finishing
