摘要
论述了以钼酸钠作释放剂选择性螫合液定法测定铅的方法，应用于测定铅基合金镀层、Ph－Sn—Cu合金镀层和电镀溶液中铅的含量。在选择条件下，金属离子均不干扰测定结果。
Selective chelatometric determination of Pb with sodium molybdate as releasing agent and its practical application in determination of Pb content in Pb alloy deposit,Pb-Sn-Cu alloy deposit and their plating solutions are described. No metal ion interference with the determination result is shown under selected conditions.
出处
《电镀与涂饰》
CAS
CSCD
1997年第1期34-37,共4页
Electroplating & Finishing
基金
甘肃省自然科学基金
