化学镀钴磷合金工艺的研究

Study on Electroless Plating Technology of Co-P Alloy

研究了以次磷酸钠为还原剂、酒石酸钾钠为络合剂的化学镀溶液，在正交试验的基础上，讨论了镀液组成和操作条件对沉积速度的影响，提出了获得良好钴磷合金镀层的最佳镀液组成和操作条件。

A new bath for electroless Co-P alloy plating used sodium hypophosphite as reducing agentand sodium-potassium tartrate as complexing agent was studied. The effects of bath compositionand operating conditions on the rate of deposition of Co-P alloy were discussed on the basis of orthogonal experiement. The optimum bath composition and operating conditions for obstaining desirable Co-P alloy coating were presented in the paper.