热控制技术的新进展

New Evolution of Thermal Control Technique

随着电子技术的快速发展,电子系统的集成度、封装度和工作频率都在不断升高,高热流密度已成为制约电子系统可靠与稳定工作的重要因素。首先介绍了常用热控制技术的现状,重点阐述近几年来国外热控制技术的最新研究成果,为电子系统的高效热设计提供一些有益的帮助。

Along with rapid development of the electronic technologies, the integration, packaging and operating frequencies of electronic system have been lifted to a higher level. Hence, high heat flux has become an important fact which restricts reliable and stable operation of electronic system. This paper firstly introuduces the present situation of some common thermal control techniques, then emphasizes the latest research achievement of thermal control technique in recent years in order to provide some help for high-efficiency thermal design of the electronic system.