摘要
利用无压烧结制备含CuO的SnO2高致密陶瓷材料。研究表明,CuO的掺杂对SnO2烧结致密度有很大的提高,烧结致密度与CuO添加量以及液相烧结工艺有着密切的关系,掺杂0.5%(摩尔分数)CuO的SnO2基陶瓷样品密度为6.88g·cm-3,相对密度达到98.97%,最佳的烧结温度为1250℃。其烧结机理为高温下生成共晶CuO-Cu2O液相大大促进了陶瓷体的烧结性能。
Tin oxide based ceramics contained copper oxide was prepared by pressureless sintered in air. The results showed that apparent density of the samples is close related with the dopant and the process of sintering. Relative density of the sample reached above 98 percent when the concentration of CuO was 0.5 mol%. Optimal sintering temperature is 1250℃ for SnO2 based ceramics with doped CuO. The mechanism of sintering is that the forming of liquid-phase eutectic CuO-Cu2O greatly promote the densification of SnO2 ceramics at high temperature.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2007年第A01期714-716,共3页
Rare Metal Materials and Engineering
关键词
二氧化锡
氧化铜
液相烧结
tin dioxide
copper oxide
liquid-phase sintering
