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集成化开关电源的若干关键技术

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摘要 指出了电源集成化是电源技术发展的必然趋势,目前混合封装技术是集成电源模块的主流方式,文章阐述了混合封装技术的若干关键技术问题和发展方向,最后介绍了若干基于混合封装技术的集成化电源模块。
出处 《电气应用》 北大核心 2007年第8期6-11,共6页 Electrotechnical Application
基金 国家自然科学基金重点资助项目(50237030)
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参考文献14

  • 1[1]Van Wyk,J D,F C Lee.Power electronics technology at the dawn of the new millennium-status and future[C].1999 IEEE 36th Annual Power Electronic Specialists Conference,1999(1):3-12.
  • 2[2]F C Lee,et al.Technology trends toward a system-in-a-module in power electronics[J].IEEE Circuits and Systems Magazine,2002,2(4):4-22.
  • 3[3]J Popovic,J A Ferreira.An approach to deal with packaging in power electronics[J].IEEE Trans Power electronics,2005,20(3):550-557.
  • 4[4]Center for Power Electronic Systems (CPES).Center Highlights for Years 7 (2004~2005),April 2005.
  • 5[5]Xiaoyu He,Xiangjun Zeng,Xu Yang,et al.A hybrid integrated power electronic module based on pressure contact technology[C].IEEE Annual Power Electronic Specialists Conference,2006:1155-1199.
  • 6[6]Z X Liang,et al.Integrated packaging of a 1kW switching module using a novel planar integration technology[J].IEEE Trans Power electronics,2005,19(1):242-250.
  • 7[7]Qiaoliang Chen,Xu Yang,Zhaoan Wang.Optimized electrical design for boost PFC IPEM[C].IEEE International Power Electronics and Motion Control Conference,2006:433-437.
  • 8[8]K Xing,F C Lee,D Boroyevich.Extraction of parasitics within wire-bond IGBT modules[C].IEEE Applied Power Electronics Conference and Exposition,APEC '98,1998:497 -503.
  • 9[9]Qiaoliang Chen,Xu Yang,Zhaoan Wang.Practical thermal design considerations for boost PFC IPEM[C].IEEE International Power Electronics and Motion Control Conference,2006:647-651.
  • 10[10]L Meysenc,M Jylh(a)kallio,P Barbosa.Power electronics cooling effectiveness versus thermal inertia[J].IEEE Trans Power electronics,2005,20(3):687-693.

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