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SoC中IP核间互联总线完整性故障测试模型 被引量:9

A New Fault Model for Testing Signal Integrity in SoCs
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摘要 在对互联总线信号完整故障发生原理进行详细分析的基础上,提出了一种有效的互联总线信号完整性故障激励检测模型——HT模型。仿真结果表明该模型在故障覆盖率和测试矢量的有效性方面分别比已有的最大激励串扰故障模型和多重跳度模型有较大的改善。 Based on the in-depth research of the property of crosstalk fault, we presented a more efficiency Half Transition (HT) model to detecting signal integrity fault in System-on-Chip (SoC) interconnects between IP cores. In comparison with Maximal Aggressor Fault (MAF) model and Multiple Transition (MT) model, this HT model can achieve 100% faults coverage and need less test pattern. The result of theoretic analyses shows the HT model's excellence in comparison with MAF model in fault coverage and with to MT model in test pattern's efficiency.
出处 《电子科技大学学报》 EI CAS CSCD 北大核心 2007年第3期611-613,631,共4页 Journal of University of Electronic Science and Technology of China
基金 国家自然科学基金资助项目(90207020)
关键词 信号完整性故障模型 IP核间互联总线 片上系统 half transition model signal integrity system-on-chip
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参考文献7

  • 1Avant! Corporation.Star-hspice manual[P].2001.
  • 2ZHOU H,WANG D F.Global routing with crosstalk constrains[C]//Proceedings International Conference on Computer Design VLSI in Computers and Processors.San Jose,CA:[s.n.],1996:310-315.
  • 3RAHMAT K,NEVES J,LEE J.Methods for calculating coupling noise in early design:a comparative analysis[C]//Proceedings International Conference on Computer Design VLSI in Computers and Processors.H.Kawaguchi:IEEE Computer Society,1998:76-81.
  • 4CUVIELLO M,DEY S,BAI X,et al.Fault modeling and simulation for crosstalk in system-on-chip interconnects[C]//IEEE/ACM International Conference on Computer-Aided Design.Washington DC:IEEE Computer Society,1999:297-303.
  • 5CAO Y.Effective on-chip inductance modeling for multiple signal lines and application to repeater insertion[J].IEEE Transaction on VLSI Systems,2002,10(6):799-805.
  • 6MOHAMMAD H T,AHMED N,NOURANI M.Testing SoC interconnects for signal integrity using extended JTAG architecture[J].IEEE Trans CAD of IC and Syst,2004,23(5):800-811.
  • 7NORDHOLZ P,TREYTANAR D,OTTERSTEDT J,et al.Signal integrity problems in deep submicron arising from interconnects between cores[C]// Proceedings IEEE VLSI Test Symposium.Washington,DC,USA:IEEE Computer Society,1998:28-33.

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  • 2张富彬,HO Ching-yen,彭思龙.静态串扰噪声识别算法[J].电子器件,2006,29(3):883-887. 被引量:2
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  • 5Kim Yongjoon,Yang Myunghoon, Park Youngkyu. An Effective Test Pattern Generation for Testing Signal Integrity [C]//Proceedings of the 15th Asian Test Symposium. Washington: IEEE Computer Society, 2006: 279-284.
  • 6Attarha A, Nourani M. Test Pattern Generation for Signal Integrity Faults on Long Interconnects [C]//Proceedings 20th IEEE VLSI Test Symposium. Washington: IEEE Computer Society, 2002: 336-241.
  • 7Yungseon E, Eisenstad W R, Ju YoungJeong, et al. A New On-chip Interconnect Crosstalk Model and Experimental Verification for CMOS VLSI Circuit Design[J]. IEEE Trans on Electron Devices, 2000, 1(47):129-140.
  • 8Cuviello M, Dey S, Bai Xiaoliang. Fault Modeling and Simulation for Crosstalk in System-on-chip Interconnects [C]// IEEE/ACM International Conference on Computer-Aided Design. CA: IEEE Computer Society, 1999: 297-303.
  • 9Cao Yu, Huang Xuejue, Chang N H, et al. Effective On-chip Inductance Modeling for Multiple Signal lanes and Application to Repeater Insertion[J]. IEEE Trans on Very Large Scale Integration Systems, 2002, 6(10): 799-805.
  • 10Tehranipour M H, Ahmed N, Nourani M. Multiple Transition Model and Enhanced Boundary Scan Architecture to Test Interconnects for Signal Integrity [C]//IEEE International Conference on Computer Design: VLSI in Computers and Processors. CA: IEEE Computer Society, 2003: 554-559.

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