FBG传感器封装工艺对交叉敏感问题的影响

Influence of Fabrication and Installation on the Cross Sensitivity of FBG Strain Sensors

研究了光纤光栅(FBG)应变传感器的封装与安装工艺对温度交叉敏感特性的影响。基于弹性力学理论对表面粘贴式和表面螺栓安装式两种典型的FBG应变传感器封装形式的交叉敏感机理进行了理论分析,并对国内几家主要的FBG传感器生产商的产品进行了测试。测试结果表明,表面粘贴式FBG应变传感器的温度交叉敏感性要大于表面安装式FBG应变传感器,与理论分析的结果相符。

The influence of packaging and installation of FBG （fiber brrager grating）strain sensors on the temperature cross sensitivity were studied. Based on the theory of elasticity, the mechanism of the thermal cross sensitivity of two types of FBG strain sensors was analyzed. Ex- periments were performed using several domestic products. The results show that the stickuptype is more thermal-cross-sensitive than the bolt-mount-type, which is in agreement with the theoretical analysis.