摘要
热模拟是毫米波中高功率放大器设计中的关键环节之一,可靠的散热结构可确保系统中有源器件工作在额定温度下,而基于有限元方法的数值模拟技术是毫米波功率放大器热分析的重要工具。针对由四块毫米波功率单片合成的Ka频段6W固态集成功放,采用有限元软件ANSYS建立了其三维热模型,对模型在空气自然对流情况下的温度分布状况进行了模拟和分析,模拟结果与实测值基本吻合,验证了模型的有效性。研究结果对毫米波功率放大器的热设计提供了重要的理论依据。
Thermal simulation is one of the design problems for millimeter-wave medium-to-high power amplifiers. Good thermal configurations were performed for the system to ensure that the active devices would be operating below their rated maximum operating temperature. Numerical simulation based on finite element method is an important tool in the thermal analysis of millimeter-wave power amplifiers. A three dimensional thermal model of a 6 W solid-state integrated power amplifier which is combined by using 1×4 monolithic millimeter-wave integrated circuit （MMIC） chips at Ka-band was built with ANSYS to calculate the temperature distribution under air free convection condition. Good agreement between simulation and experiment and which demonstrated the effectiveness of the thermal model. The simulated results provide a theoretical basis for thermal design of millimeter-wave power amplifiers.
出处
《电子科技大学学报》
EI
CAS
CSCD
北大核心
2007年第4期713-715,719,共4页
Journal of University of Electronic Science and Technology of China
基金
军事电子预研项目
关键词
有限元法
毫米波功率放大器
单片毫米波集成电路
热设计
finite element method
millimeter-wave power amplifiers
monolithic millimeter-wave integrated circuit
thermal design
