摘要
研制了一种以玻璃粉作为粘结相的低温烧结型银基浆料，并应用于集成电路半导体芯片贴装工艺。重点考察了半导体芯片与氧化铝陶瓷基座组装后的附着力，以研究浆料中银粉、玻璃粉和有机载体的含量以及芯片的净化处理工艺、烧结工艺对组装件剪切力和温度循环后剪切力的影响。结果表明：采用有机溶剂和皂化除油，银粉和玻璃粉质量比为7：3，有机载体和固体相质量比为1：9，在430℃烧结，保温时间在20～25min时，能获得最大剪切力。
The authors of the present article developed a low-temperature sintered silver paste which added the glass frit as binder phase and was applied to the integrated circuits semiconductor chip technology. Through researching the preparation technology of paste, it is focused on the investigation of adhesion after assembled semiconductor chips and alumina ceramic substrate. The influence of the content of silver, frits and organic vehicles, the cleaning process of chips, the sintered technique on the adhesion assembiy parts after temperature cycling is studied. The results show： by using organic solvent and saponification reaction degreasing, the ratio of silver and frits is 7 ： 3, the ratio of organic vehicles and solid powder is 1：9, sintered at 430℃ and holding for 20～25 min, can obtained the optimal shear force.
出处
《粉末冶金材料科学与工程》
EI
2007年第4期211-215,共5页
Materials Science and Engineering of Powder Metallurgy
基金
国防科学技术工业委员会资助项目(JPPT-115-471)
关键词
银基浆料
剪切力
粘结剂
silver paste
shear force
adhesion
