摘要
文章以2004年～2007年上半年发表的半固化片浸渍加工技术与设备的日本专利为研究对象,对此创新内容及思路加以综述。
In the paper, the technology and equipment about impregnation processability ofprepreg according to Japanese patent from 2004 to june 2007 were researched. At the same, content and method of innovation were reviewed.
出处
《印制电路信息》
2007年第9期9-12,30,共5页
Printed Circuit Information
关键词
印制电路板
覆铜板
浸渍加工
半固化片
printed circuit board（PCB）
copper clad laminate（CCL）
impregnation processability
prepreg
