用模拟仿真软件预测嵌入元件的热效应

A Simulation Software for Predicting Thermal Performance of Embedded Components

文章讲述了使用仿真软件预测多层板中嵌入的被动元件的热行为。在计算机中,我们使用传输线矩阵(TLM)扩散法来生成内部嵌入元件的模型。每个元件包含几百个温度计量点,并可以进行三维模拟。线路板上的温度分布情况能够很精确的表示出来,典型的一个情况就是一块线路板上有100000个温度计量节点。软件会利用这些三维的数据结果建立详细的元件和线路板的设计规则,这些规则是依照板上热量的分布情况而制定出来的。文中也讨论了如何利用本软件来反映其它方面的热效应,比如不同结构的板的热量分布是不一样的,因为这些板的厚度,铜面位置都不同。另外,该软件还能反映表面安装元件的热效应。

This paper describes the research that has lead to a software tool that predicts the thermal behaviour of embedded passive components in multilayer PCBs. Internal component models are generated using the Transmission Line Matrix （TLM） diffusion method. Individual components can contain hundreds of temperature calculation points and are modelled in 3-Dimensions. High resolution board detail is also achieved, with a board typically containing over 100,000 temperature calculation nodes. The software then uses the results from this 3-D data to build up detailed component and board level thermal design rules. The paper also touches on how the software takes into account additional thermal aspects such as board structure, including thickness and position of copper planes and the other aspects of surface mounted components.